Signal-Integrity-Aware ILP Routing for Practical 2.5D Chiplet Interconnects
Published in IEEE Transactions on Components, Packaging and Manufacturing Technology, 2025
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Recommended citation: Yunhui Li, Lihao Liu, Hongwei Xu, Han Diao, Li Shang, Cheng Yang, Zhicheng Ding, Fan Yang, "Signal-Integrity-Aware ILP Routing for Practical 2.5D Chiplet Interconnects." IEEE Transactions on Components, Packaging and Manufacturing Technology, 2025.